The Thin Films Lab is a unique facility at HNEI, boasting sophisticated state-of-the-art equipment for the fabrication and testing of thin film materials (<1µm thick) and devices. The lab has developed novel semiconductor, dielectric, and catalyst films for a diverse range of applications, including photovoltaics, solar hydrogen production, and optical sensors.

The following deposition tools and instrumentation are located in the Thin Films Laboratory and are available full time for HNEI research efforts.

Deposition Equipment

	PECVD System: MV-Systems dual-chamber high-vacuum "plasma enhanced chemical vapor deposition" system with load lock for depositing amorphous and microcrystalline silicon and germanium alloys. Applications include fabrication of photovoltaic materials and devices; and visible and infrared sensors.
	CIGS Evaporation System: Varian 3125 diffusion-pumped multisource evaporator including five independently-controlled furnaces for elemental co-deposition of copper, indium, gallium, selenium and sodium. For fabrication of CIS and CIGS photovoltaic materials and devices.
	Sputtering Deposition System: Perkin-Elmer 2400 turbomolecular-pumped three-gun co-sputtering system. Applications include: transparent conducting oxides; catalysts and other novel films; and refractory metal films.
	Metal Thermal Evaporation System: NRC 3117 diffusion-pumped four-source thermal evaporator for depositing metallic films and contact grids.
	Diamond-like Films: ASTEX PDS-16 microwave plasma enhanced diamond deposition system. Not currently operational.
	CdS Film Deposition: Chemical bath system currently handling two 5 cm x 9 cm substrates. Expandable to a larger area.

Instrumentation

	Semiconductor/Solar Cell Characterization Station: including high-precision electronic measurement equipment, temperature-controlled probe chuck, solar simulator and LED light sources. Measurement capabilities include: temperature-dependent light/dark JV characterization (pA resolution) temperature-dependent AC & DC conductivity measurement temperature-dependent CV measurement transient response characterizations (ns resolution)
	Electrochemical Test Station: including high-precision electronic measurement equipment and Plexiglas fixtures for test- and reference-electrode mounting. Measurement capabilities include voltammetry and cyclic voltammetry (pA resolution), and long-term corrosion testing.
	Quantum Efficiency System: MRG model QE1800 for measurement of photocollection in thin film devices in the 350 - 1800nm wavelength range.
	UV-VIS Photospectrometer: Perkin-Elmer model Lambda 2 with integrating sphere: for optical transmission, reflection and absorption measurements of thin films.
	Surface Profilometer: Tencor Alpha Step model 200 for thin-film thickness measurements.
	Four-Point Probe Station: Signatone model S301-6: automated system for film resistivity measurements.
	Gas Chromatograph: Varian with TCD/FID detectors. Gas Chromatograph: Shimadzu GC14-A.

Surface Analysis at UH
In addition to the HNEI equipment listed above, the UH campus boasts a wide range of sophisticated surface analysis techniques which are generally available on a recharge basis.

X-ray Diffraction system (Scintag model PAD V) Scanning Electron Microscope (Zeiss Model DSM-962) with EDX capability High resolution Scanning Electron Microscope (Hitachi model S-800) Fourier Transform Infrared Spectrometer (Thermo-Nicolet) Two Spex triplemate Raman instruments with C.C.D. detectors, computer controlled data acquisition system and micro Raman attachment Advanced Confocal Microscope (Bio-Rad Micro-science Division) Atomic Force Microscope (Nanoscope Instuments) Scanning Tunneling Microscope (Nanoscope Instruments) Ernst-Leitz Scanning Acoustic Microscope (ELSAM) Sandercock six-pass tandem Brillouin scattering system Fully automated ellipsometer (Auto-EL-III Rudolph Research)